PEX8112

 

 

 

Features 

General Features 

Forward and Reverse bridging

144-ball BGA package with standard 

1.0 mm pitch (13mm x 13mm)

161-ball BGA package with fine 

0.65 mm pitch (10mm x 10mm)

Low power – 400 milliwatts

EEPROM configuration option with SPI

Internal 8Kbyte shared RAM

1.5 V core supply voltage

JTAG 

Four (4) GPIO pins for maximum 

design flexibility

Extensive PME support including 

D0 and D0Active, D1, D2 and D3Hot

and D3Cold

Lead-free packaging only

Industrial Temperature: -40 to +85ºC

 

 

 

 

 

**注意 & Noted:

Because of wholesale price is different from sample price, our website cannot state. Please contact us online. As well as welcome you call us : 0755-83957301.We will offer a right price; Sometimes manufacturer's price is unstable, so we don't adjust price in time. if you feel price is a little high for you, just feel free to contact us for consultation. Thank you for your support !

 

由于批量与样品的价格不同，网上无法统一注明，请您把采购型号通过邮件或客服QQ2850151584发给我们，也可致电明佳达国内销售部：0755-83957301，由客服人员为您报价；有时元件厂商价格稍许变动，本公司未能及时调整，如您觉得售价偏高，请与我们说明并适当议价；感谢支持!